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논문 기본정보

Reverse-bias Leakage Current Mechanisms in Cu/n-type Schottky Junction Using Oxygen Plasma Treatment

논문 개요

기관명, 저널명, ISSN, ISBN 으로 구성된 논문 개요 표입니다.
기관명 NDSL
저널명 Transactions on electrical and electronic materials
ISSN 1229-7607,
ISBN

논문저자 및 소속기관 정보

저자, 소속기관, 출판인, 간행물 번호, 발행연도, 초록, 원문UR, 첨부파일 순으로 구성된 논문저자 및 소속기관 정보표입니다
저자(한글)
저자(영문)
소속기관
소속기관(영문)
출판인
간행물 번호
발행연도 2016-01-01
초록 Temperature dependent reverse-bias current-voltage (I-V) characteristics in Cu Schottky contacts to oxygen plasma treated n-InP were investigated. For untreated sample, current transport mechanisms at low and high temperatures were explained by thermionic emission (TE) and TE combined with barrier lowering, respectively. For plasma treated sample, experimental I-V data were explained by TE or TE combined with barrier lowering models at low and high temperatures. However, the current transport was explained by a thermionic field emission (TFE) model at intermediate temperatures. From X-ray photoemission spectroscopy (XPS) measurements, phosphorus vacancies (VP) were suggested to be generated after oxygen plasma treatment. V P possibly involves defects contributing to the current transport at intermediate temperatures. Therefore, minimizing the generation of these defects after oxygen plasma treatment is required to reduce the reverse-bias leakage current.
원문URL http://click.ndsl.kr/servlet/OpenAPIDetailView?keyValue=03553784&target=NART&cn=JAKO201614859329557
첨부파일

추가정보

과학기술표준분류, ICT 기술분류,DDC 분류,주제어 (키워드) 순으로 구성된 추가정보표입니다
과학기술표준분류
ICT 기술분류
DDC 분류
주제어 (키워드) InP,Current transport mechanisms,Phosphorous vacancies