- HOME
- 홈페이지 이용안내
논문 기본정보
The Study on Thermal Performance Evaluation of Building Envelope with VIPs
논문 개요
| 기관명 | NDSL |
|---|---|
| 저널명 | KIEAE journal = 한국생태환경건축학회논문집 |
| ISSN | 2288-968x,2288-9698 |
| ISBN |
논문저자 및 소속기관 정보
| 저자(한글) | Jeon, Wan-Pyo,Kwon, Gyeong-Jin,Kim, Jin-Hee,Kim, Jun-Tae |
|---|---|
| 저자(영문) | |
| 소속기관 | |
| 소속기관(영문) | |
| 출판인 | |
| 간행물 번호 | |
| 발행연도 | 2016-01-01 |
| 초록 | Purpose: The energy consumption in buildings has continuously increased in some countries and it reaches almost 25% of the total energy use in korea. Therefore there are various efforts to minimize energy consumption in buildings, and the regulations on building envelope insulation have been tightened up gradually. To satisfy the building regulation, the use of vacuum insulation panels(VIPs) is increasing. VIP is a high performance insulation materials, so that it can be thinner than conventional insulation material. When VIP is applied in a building, it may cause thermal bridge, which occurs due to very low thermal conductivity compared to other building materials and the envelope of VIPs. Method: This study designed the capsulized VIPs using conventional insulation for reduction of the thermal bridge. Then designed VIPs were applied to a wall. The linear thermal transmittance and the effective thermal conductivity were analyzed by HEAT2 simulation program for two dimensional steady-state heat transfer. The result compared with a wall with non-capsulized VIPs. Result: It analyzed that the wall with capsulized VIPs had lower linear thermal transmittance and reduced the difference of the effective thermal transmittance with one dimensional thermal transmittance compared to that of the wall with non-capsulized VIPs. |
| 원문URL | http://click.ndsl.kr/servlet/OpenAPIDetailView?keyValue=03553784&target=NART&cn=JAKO201610254117313 |
| 첨부파일 |
추가정보
| 과학기술표준분류 | |
|---|---|
| ICT 기술분류 | |
| DDC 분류 | |
| 주제어 (키워드) | 진공단열패널,선형열관류율,유효열관류율,열교,건물외피,Vacuum insulation panel,Lineal thermal transmittance,Effective thermal transmittance(U-value),Thermal bridge,Buildig Envelope |