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논문 기본정보
방사광 LIGA 공정을 이용한 플라스틱 성형용 마이크로 금형 제작
논문 개요
| 기관명 | NDSL |
|---|---|
| 저널명 | 한국기계가공학회지 = Journal of the Korean Society of Manufacturing Technology |
| ISSN | 1598-6721,2288-0771 |
| ISBN |
논문저자 및 소속기관 정보
| 저자(한글) | 이봉기,김종현 |
|---|---|
| 저자(영문) | |
| 소속기관 | |
| 소속기관(영문) | |
| 출판인 | |
| 간행물 번호 | |
| 발행연도 | 2015-01-01 |
| 초록 | In the present study, copper micromolds with a microhole array were precisely manufactured by a synchrotron LIGA process. Like in the traditional LIGA process, a deep X-ray lithography based on a synchrotron radiation was employed as the first manufacturing step. Due to the excellent optical performance of the synchrotron X-ray used, cylindrical micropillar arrays with high aspect ratio could be efficiently obtained. The fabricated microfeatures were then used as a master of the subsequent copper electroforming process, thereby resulting in copper micromolds with a microhole array. Thermoplastic hot embossing experiments with the copper micromolds were carried out for imprinting cylindrical microfeatures onto a polystyrene sheet. Through the hot embossing, the effect of embossing temperature and usefulness of the present manufacturing method could be verified. |
| 원문URL | http://click.ndsl.kr/servlet/OpenAPIDetailView?keyValue=03553784&target=NART&cn=JAKO201525550547960 |
| 첨부파일 |
추가정보
| 과학기술표준분류 | |
|---|---|
| ICT 기술분류 | |
| DDC 분류 | |
| 주제어 (키워드) | LIGA 공정,마이크로 금형,방사광,전주도금,핫 엠보싱,LIGA Process,Micromold,Synchrotron Radiation,Electroforming,Hot Embossing |